| 摘要 |
PURPOSE: A wafer alignment system and a wafer alignment method are provided to accurately align a position of a wafer to a criterion position. CONSTITUTION: A wafer alignment method comprises the steps of: forming a first mark on a wafer; sensing an image of the first mark formed on the wafer; generating a virtual image of a second mark; outputting an alignment parameter by comparing a distance between the images of the first and second marks; and realigning a position of the wafer based on the alignment parameter. A wafer alignment system comprises the first mark formed in a predetermined form on a wafer, a sensing unit for sensing the image of the first mark, an image generating unit for generating the image of the second mark, a comparing unit for comparing the distance between the images of the first and second marks and outputting the alignment parameter, and an alignment controlling unit for outputting a plurality bit of control signals controlling a wafer stage based on the alignment parameter to the wafer stage.
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