Apparatus and method for mounting semiconductor chips on a substrate,申请号HK20000102618-传众专利搜索

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发明名称	Apparatus and method for mounting semiconductor chips on a substrate
摘要
申请公布号	HK1025217(A2)	申请公布日期	2000.09.29
申请号	HK20000102618	申请日期	2000.04.29
申请人	ESEC SA.	发明人	ROLAND STALDER
分类号	H01L;H01L21/00;(IPC1-7):H01L	主分类号	H01L
代理机构		代理人
主权项
地址

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