| 摘要 |
PROBLEM TO BE SOLVED: To reduce the fraction defective by integrating predetermined arbitrary number of semi-conductor devices with each other as a set with the taping fractions in a taped condition using a connection member having a tape bolding portion on each side in a condition ready for shipping to reduce the man-hour related to the packing. SOLUTION: A fraction connection member 1 is long and formed of a transparent hard plastic, and has a holding portion 1a capable of holding a tape part of a taping fraction 10 on each side. Both side tape parts of some strip-like taping fractions 10 are held by the portion 1a in a sliding manner from the transverse direction and stored in the connection member 1. The thickness and width of the holding portion 1a of the fraction connection member 1 are appropriately determined with respect to a cover tape 4 and a carrier tape 3 for the taping fractions 10 so that the fractions 10 do not overlap each other when the fractions are successively packed. In addition, the fraction connection member 1 is cut to the length corresponding to the semi-conductor devices of arbitrary number in advance.
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