| 摘要 |
PROBLEM TO BE SOLVED: To provide the IC card of high performance and high physical strength for appropriately housing the sheet-like capacitor of a desired capacity in a narrow mounting area. SOLUTION: For this IC card 100, a substrate 101 is divided into a coil formation area 102 and an IC mounting area 103 and a coil 130 is formed by copper foil in the coil formation area 102. In the IC mounting area 103, an IC 112 is mounted on one surface and the capacitor 120 is formed on the back surface. At the time, the formation area of the capacitor 120 is made larger than the mounting area of the IC 112 on the opposite surface. By that, since the capacitor 120 is formed on the back surface of the IC mounting part, a new area is not practically required. Also, by forming the capacitor 120, the flatness of the mounting surface of the IC 112 is raised and the connection defect of the IC 112 or the like is hardly caused.
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