| 摘要 |
PROBLEM TO BE SOLVED: To increase the range of selection of a sheet and an adhesive for bonding the sheet to a silicon insulator wafer, and to select a material with importance attached to economic advantage and efficiency by preventing an enchant from diffusing to the sheet and the surface of the wafer through means of a suction guide. SOLUTION: The main surface of a silicon-on-insulator wafer 14 is fixed with a sheet 13 having an adhesive layer, and a surface opposite to the main surface of the wafer 14 is exposed to an etchant from a blow-up guide 16, and the etchant is absorbed from around the wafer so that it does not make contact with the adhesive layer.
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