发明名称 GROOVE WORKING METHOD OF ELECTRONIC PART SUBSTRATE
摘要 <p>PROBLEM TO BE SOLVED: To prevent the occurrence of burs completely at working grooves on a substrate for electronic parts. SOLUTION: A substrate 1 for electronic parts with metal foil, e.g. copper foil 1A put on its surface is worked for grooves, at this time, prior to the groove work of the substrate 1, the copper foil 1A is removed from an area corresponding to the side opposite to the groove working side of the substrate. By working grooves in the state, the occurrence of burs can be prevented completely by the copper foil 1A even in using a groove working means (a mold, a router, water jet, or the like) during groove formation.</p>
申请公布号 JP2000246730(A) 申请公布日期 2000.09.12
申请号 JP19990050581 申请日期 1999.02.26
申请人 ROHM CO LTD 发明人 ISOKAWA SHINJI
分类号 B26F3/00;B28D5/00;H01L21/301;(IPC1-7):B28D5/00 主分类号 B26F3/00
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