| 摘要 |
<p>PROBLEM TO BE SOLVED: To raise versatility independent of a specific application while a mounting area is reduced for smaller size. SOLUTION: A flexible tape carrier 30 where wiring is formed, a semiconductor chip 40 which is mounted on the tape carrier 30 and electrically connected to wiring, and a plurality of electronic devices comprising a passive part 50, etc., are provided in a reference structure body A, a plurality of which are laminated to be a laminated body. Each of end part regions of the tape carriers 30 is bent so as to almost upright to the region where an electronic device is mounted and also as joint each other, forming an upright bent part B, which are provided with electric connection parts C electrically connected each other.</p> |
