PHENOLIC RESIN SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide phenolic resin substrates capable of retaining good conducting resistance of through-holes even when a copper paste is filled in the through-holes. SOLUTION: In the phenolic resin substrate obtained by forming through-holes 2 in the substrate main body 1 prepared by impregnating a substrate with a phenolic resin composition and curing the phenolic resin composition with heating under pressure, and filling a copper paste 3 in the through-holes 3, the phenolic resin composition contains an antioxidant which can prevent the oxidation of the copper paste 3.