A METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

摘要

PURPOSE: A method for manufacturing a semiconductor device is provided to confirm easily uniformity of a pattern according to a location of a wafer by reducing diffused reflection due to a stepped portion of a vernier. CONSTITUTION: A parent vernier(21a) and a child vernier(21b) are formed as a rim having a line width of Z when forming an overlay vernier. At this time, the line width of Z is not determined. A signal error and mis-alignment are prevented by minimizing a stepped portion due to the parent vernier(21a). Resolution marks(22) are formed simultaneously at each edge of a parent vernier box and a child vernier box when forming the overlay vernier.