发明名称 PHENOLIC POLYMER AND EPOXY RESIN CURING AGENT USING THE SAME
摘要 PROBLEM TO BE SOLVED: To obtain a phenolic polymer having a low melt viscosity and a high glass transition temperature and being capable of being used as an epoxy curing agent by etherifying a specified proportion of the hydroxyl groups of a triphenylmethane type resin having a specified structure. SOLUTION: A partially etherified phenolic polymer is obtained by etherifying 5-50 mol% hydroxyl groups of a triphenylmethane type resin obtained by condensing a phenol with an aromatic carbonyl compound in the presence of an acidic catalyst and represented by the formula (wherein (n) is 0-4; (a), (b), (c), (d), and (e) are each 0-2; and the average of the substituted hydroxyl groups is 0.5-2.0 per phenyl). The partial esterification consists of dissolving a triphenylmethane resin in an organic solvent such as an alcohol, adding a base to the solution, adding an alkenically, allylically, or otherwise unsaturated halohydrocarbon to the mixture, and reacting the reaction mixture to obtain an alkenyl ether, an allyl ether or the like.
申请公布号 JP2000234008(A) 申请公布日期 2000.08.29
申请号 JP19990036448 申请日期 1999.02.15
申请人 SUMIKIN CHEMICAL CO LTD 发明人 ITO YUKO;OHIRA MASATO;SONE YOSHIHISA
分类号 C08G8/28;C08G59/62;(IPC1-7):C08G8/28 主分类号 C08G8/28
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