| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board manufacturing method by which bumps formed on a plurality of connecting terminals of an integrated circuit board can be made uniform in height, by controlling the meted amount of solder correspondingly to the warp of the board. SOLUTION: In a solder paste applying process, solder paste is applied in fixed thickness to a plurality of connecting terminals 10a-10c formed on the surface of a circuit board 1 and, in a bump adjusting and forming process, the melted amount of solder in the paste 2 by the heat supplied from a local heating heat source 3 is adjusted and controlled in accordance with the amount of warp of the board 1, by adjusting and controlling the quantity of radiant heat from the heat source 3, the duration of radiant heat from the heat source 3, or the heat emitting and scanning area of the heat source 3. Therefore, the front ends of solder bumps formed on and connected to the terminals 10a-10c are nearly flush in the same plane and, when an integrated circuit chip is connected to and mounted on the board 1, the occurrence of defective connection can be prevented. |
