发明名称 |
Apparatus for retaining a subtrate in a semiconductor wafer processing system and a method of fabricating same |
摘要 |
An electrostatic chuck including a body of ceramic and a metal backing portion for mounting the chuck directly to a metal pedestal and a process of manufacturing the electrostatic chuck using sintering. The electrostatic chuck contains a metal backing portion having at least one hole extending therethrough and the body of ceramic includes at least one portion extending through the hole.
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申请公布号 |
US6104596(A) |
申请公布日期 |
2000.08.15 |
申请号 |
US19980063764 |
申请日期 |
1998.04.21 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
HAUSMANN, GILBERT |
分类号 |
H01L21/683;(IPC1-7):H02N13/00 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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