发明名称 Apparatus for retaining a subtrate in a semiconductor wafer processing system and a method of fabricating same
摘要 An electrostatic chuck including a body of ceramic and a metal backing portion for mounting the chuck directly to a metal pedestal and a process of manufacturing the electrostatic chuck using sintering. The electrostatic chuck contains a metal backing portion having at least one hole extending therethrough and the body of ceramic includes at least one portion extending through the hole.
申请公布号 US6104596(A) 申请公布日期 2000.08.15
申请号 US19980063764 申请日期 1998.04.21
申请人 APPLIED MATERIALS, INC. 发明人 HAUSMANN, GILBERT
分类号 H01L21/683;(IPC1-7):H02N13/00 主分类号 H01L21/683
代理机构 代理人
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