发明名称 SOLDERING METHOD, PRINTED WIRING BOARD, AND MOUNTING PART SUITABLE FOR THEM
摘要 PROBLEM TO BE SOLVED: To positively increase a soldering rigidity for sufficient reliability when soldering with an automatic soldering machine, surely increasing the amount of solder sticking to the lead and land of a mounting part which requires match amount of sticking solder. SOLUTION: A through-hole 6, in which a lead 8 of a mounting part is inserted, is formed at a printed wiring board main body 3a, and a land 4 for soldering for connection, the lead 8 of mounting part inserted in the through-hole 6 is provided around the through-hole 6 on the rear surface side. A metal part 10a which is an auxiliary member for increasing the amount of sticking solder 2 to the lead 8 is provided by plural numbers, in the same land 4. Allocation of the metal parts 10a is automatically performed by a surface-mounting part attaching machine. A solder bridge takes place between the metal part 10a and the lead 8, so that the amount of solder 2 sticking to the lead 8 is increased.
申请公布号 JP2000208908(A) 申请公布日期 2000.07.28
申请号 JP19990010489 申请日期 1999.01.19
申请人 MITSUBISHI ELECTRIC CORP 发明人 NOJIOKA SHINICHI
分类号 B23K1/00;B23K3/00;H01R4/02;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K1/00
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