| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device, capable of independently analyzing an IP(Interactual Property) chip packaged on a substrate as a MCP (Multiple Chip Package) together with a microcomputer CPU chip and for simplifying failure analysis. SOLUTION: An MCP terminal 5 and an IP chip 3 are connected through bonding of terminal 7 for bonding option arranged on a package substrate 1, outputs of a port circuit 12 and a MCP port circuit 13 are inhibited by a control circuit 14, and the IP chip 3 can be analyzed independently through signal exchange between the IP chip 3 and outside without the intermediary of a microcomputer CPU chip 2. |
