| 摘要 |
PROBLEM TO BE SOLVED: To protect a voltage variable integrated circuit against transient of EOS(electrical overstress) by providing a voltage variable material layer on an integrated circuit die while filling the gap between a plurality of I/0 pads and a conductive guard rail. SOLUTION: An integrated circuit is provided, on the surface of a die 10, with a plurality of conductive I/0 pads 25 connected electrically with a functional die area 20. A conductive guard rail 30 is provided contiguously to the I/0 pads 25 on the die 10 and a metal trace is provided. A gap 25a is formed between the guard rail 30 and each I/0 pad 25 and filled with a voltage variable material 35. According to the arrangement, the integrated circuit can be protected against extremely high energy associated with EOS transient. |
