WAFER PROCESSING APPARATUS FOR FABRICATING SEMICONDUCTOR DEVICE

摘要

PURPOSE: A wafer processing apparatus for fabricating a semiconductor device is provided which can improve the uniformity of processes such as an etching process and a cleaning process by minimizing the temperature variation of a wafer processing solution supplied to the wafer placed on a spin chuck. CONSTITUTION: A wafer processing apparatus includes a shaft(2), a chuck which is supported by the shaft and where a wafer(W) is fixed, a solution nozzle(25) to supply a wafer processing solution onto the wafer, a gas supply unit(50) supplying gas to the back of the wafer and a heater(30) for heating the gas supplied to the back of the wafer. And a gas nozzle can be attached which can supply gas to the horizontal side of the solution nozzle, being separated from the solution nozzle. The apparatus can perform a conductor plug formation process and a planarization process effectively.