| 摘要 |
PROBLEM TO BE SOLVED: To provide chip electronic components where mounting strength and electrical connection are ensured, even when performing bonding to an electrode on a surface that is cut by dicing for exposing an insulation substrate and self-alignment is enabled in soldering, and to provide their manufacturing method. SOLUTION: An electrode 2 is provided on a surrounding surface which is connected to a side surface from a surface for placing an LED element 3 other than the cutting surface (upper and lower surfaces as illustrated) of an insulation substrate 1. A cylindrical cut-out part 9 is formed along an edge being directed from the surface for placing the LED element 3 to its reverse side out of the edges on the cutting surface, and an electrode is extended on the cut-out surface. The cut-out surface and electrode surface of a mother board face opposite each other while being separated by space, solder is used for the space, and strong connection is made while fully making self-alignment function to act. |
