| 摘要 |
PROBLEM TO BE SOLVED: To provide an inter-layer insulating film of a semiconductor device and/or surface protective film composite, wherein a coat of good film condition while being superior in heat-resistance with low dielectric and low hygroscopicity is formed, and to provide a semiconductor device which is superior in moisture- resistance reliability of, the coat is formed as an inter-layer insulating film and/or surface protective film. SOLUTION: A polyquinoline resin or polyquinoxaline resin, and a solvent whose essential component is a compound such as indicated by a formula (where R is alkyl group of carbon numbers at least 2, vinyl group, cyclohexyl group, or phenyl group) are comprised. A coat comprising the polyquinoline resin or polyquinoxaline resin formed with the composition is provided as an inter- layer insulating film and/or surface protective film of the wiring layer on a semiconductor substrate.
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