发明名称 |
Process for manufacturing a multi-layer circuit board |
摘要 |
A multi-layer circuit board capable of reducing an electrical resistance between circuit patterns positioned inside the circuit board and a through-hole connection conductor. A plurality of circuit patterns are superposed on each other with a plurality of insulating layers being alternately interposed therebetween in turn. A solution in which ultrafine metal particles of the independent dispersion type such as silver, gold, palladium or the like are contained in a colloid-like manner is applied so as to extend from one of lands through an inner surface of a through-hole to the other land. Then, the solution is calcined to form a metal particle film, The metal particle film is coated thereon with a conductive paste such as a resin/silver paste or the like, which is then calcined to form a conductive paste layer.
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申请公布号 |
US6083340(A) |
申请公布日期 |
2000.07.04 |
申请号 |
US19980124692 |
申请日期 |
1998.07.29 |
申请人 |
HOKURIKU ELECTRIC INDUSTRY CO., LTD. |
发明人 |
NOMURA, KAZUO;ISHIYAMA, ICHIRO;HIGASHI, KOJI;KATO, MASAKI;NAGARE, ICHIRO;KUROKAWA, HIROYUKI;OHARA, YOZO |
分类号 |
H05K3/40;H05K3/42;H05K3/46;(IPC1-7):B32B31/20 |
主分类号 |
H05K3/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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