| 摘要 |
PROBLEM TO BE SOLVED: To substantially increase a treatment quantity of bases without impairing the high quality of the coating applied on the surfaces of the bases by providing a method for the plasma treatment of the surface of the bases by substantially reducing the working time over the entire part of the treatment manipulation of the bases and an apparatus therefor. SOLUTION: The apparatus for the plasma surface treatment of the bases S1 and S2 comprise an evacuatable treatment chamber 1 and two adjacent similarly evacuatable pretreatment chambers 2 and 3. Both of these pretreatment chambers 2 and 3 have plasmatrons 20 and 30. The first base S1 is subjected to a plasma coating in the treatment chamber 1 and simultaneously the second base S2 to be next subjected to the plasma coating is simultaneously subjected to the pretreatment by the plasmatron 20 in the pretreatment chamber 2. The second has S2 is alternately heated and washed by connecting the second base as a cathode to generate an electric arranged 25A between the base S2 and the plasmatron 20 during the washing manipulation. The quality of the coating is, therefore, made to meet the highest requirement and the treatment quantity may be nearly increased. |
