| 摘要 |
PROBLEM TO BE SOLVED: To cut down the time of exposing without increasing the power of a light source in the exposing process performed on the circumferential region outside the circuit forming region of a substrate when a resist pattern is formed. SOLUTION: When the outside circumferential region of a circuit formation region is exposed for thr purpose of dissolving the resist on the outside circumferential region of the circuit formation region by development on the resist applied substrate which is exposed using the prescribed pattern mask, the substrate edge of the circuit formation region is formed along X or Y direction, the outer edge of the circuit formation region is formed along X and Y direction, and the exposing part is constituted in such a manner that the exposing part is formed in square shaped ring-like exposing region. An exposing operation is performed in a state such that the edge of the above-mentioned exposing region and the outer edge of the circuit forming region are almost brought into parallel with each other while the exposing part is moved in the surface direction of the substrate relatively and continuously to the surface direction of the substrate in X or Y direction. As a light emitting region becomes narrow when the exposing region is formed in ring shape, the consumption of power necessary for emission of light is decreased, and also the time required for exposing can be cut down because the exposing part of the substrate is moved relatively and continuously.
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