| 摘要 |
<p>The present invention is directed to a method and apparatus (2) for polishing a surface of a semiconductor wafer (18) using a pad (6) moveable in both forward and reverse directions. In both VLSI and ULSI applications, polishing the wafer surface (18) to complete flatness is highly desirable. The forward and reverse movement of the polishing pad (16) provides superior planarity and uniformity to the surface of the wafer (18). The wafer surface is pressed against the polishing pad (6) as the pad moves in both forward and reverse directions while polishing the wafer (18) surface. During polishing, the wafer (18) is supported by a wafer housing (4) having a novel wafer loading and unloading method.</p> |
