发明名称 Contact structure of semiconductor memory device for reducing contact related defect and contact resistance and method for forming the same
摘要 A contact structure for a semiconductor memory device that reduces contact related defects and contact resistance and a method for forming the same are provided. The semiconductor memory device having an insulation layer formed on a conductive layer includes a contact formed within an opening having a bilobate shape. The contact passes through a part of the insulation layer up to the upper surface of the conductive layer from the top of the insulation layer.
申请公布号 US6072242(A) 申请公布日期 2000.06.06
申请号 US19980209649 申请日期 1998.12.10
申请人 SAMSUNG ELECTRONICS, CO., LTD. 发明人 SON, JIN-YEONG
分类号 H01L21/28;H01L21/027;H01L21/768;H01L23/522;(IPC1-7):H01L23/48;H01L23/52;H01L29/40 主分类号 H01L21/28
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