发明名称 RESIN COMPOSITE, PRINTED CIRCUIT BOARD AND MULTILAYER PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To obtain a resin composite that shows high fracture strength and high fracture toughness and low dielectric constant and low dielectric loss tangent, even when the thermosetting resin and the thermoplastic resin are spinodally decomposed, by compounding a thermosetting polyaryl ether with a thermoplastic resin. SOLUTION: This resin composite is composed of (A) a thermosetting polyaryl ether and (B) a thermoplastic resin. As the component A, is preferably a thermo- setting poly(phenylene ether), particularly an allylated polyphenylene ether. The allylated polyphenylene ether is prepared, for example, by lithiumizing a polyphenylene ether with butyllithium, and allowing an allyl halide to react with the lithiumized polyphenylene ether. The component A has preferably a weight-average molecular weight of 10,000-80,000. As the component B, are cited, for example, polyethersulfone, polyetheramide or the like and the composite ratio of the components A to B is preferably 10/90-60/40 by weight.
申请公布号 JP2000143967(A) 申请公布日期 2000.05.26
申请号 JP19980319670 申请日期 1998.11.10
申请人 IBIDEN CO LTD 发明人 O TOUTO;ASAI MOTOO;SHIMADA KENICHI
分类号 H05K3/46;B32B27/00;C08L67/03;C08L71/00;C08L71/12;C08L79/08;C08L81/02;C08L81/06;(IPC1-7):C08L71/00 主分类号 H05K3/46
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