Semiconductor assembly, especially with microwave chips e.g. for a mobile telephone, has a thin heat radiating substrate formed by diffusion metallization of molten copper into a molybdenum pressing

摘要

Semiconductor assembly, has a thin heat radiating substrate formed by diffusion metallization of molten copper into a molybdenum pressing. A semiconductor assembly, with mounted chips, has a less than 0.4 mm thick heat radiating substrate of a copper - molybdenum (Cu-Mo) composite material formed by diffusion metallization of 30-40 wt.% copper in molten form into a molybdenum pressing. Independent claims are also included for the following: (i) an isostatic pressing process for producing a pressing for forming a composite material for the above semiconductor assembly; and (ii) a process for producing a heat radiating substrate for the above semiconductor assembly.