发明名称 Method for aligning a wafer
摘要 A method for aligning a wafer on a support member within a vacuum chamber includes increasing the pressure within the vacuum chamber to at least about 1 Torr before aligning the wafer. The wafer is introduced into the vacuum chamber on the support member, the pressure is increased to at least about one Torr, and the support member is lifted into a shadow ring that has a frustoconical inner cavity constructed to funnel the wafer to a centered, aligned position.
申请公布号 US6063440(A) 申请公布日期 2000.05.16
申请号 US19970893461 申请日期 1997.07.11
申请人 APPLIED MATERIALS, INC. 发明人 CHEN, LING;YUDOVSKY, JOSEPH;YU, YING;LEI, LAWRENCE C.
分类号 C23C14/50;C23C16/44;C23C16/458;H01L21/02;H01L21/205;H01L21/68;(IPC1-7):C23C16/00 主分类号 C23C14/50
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