发明名称 |
USE OF ZETA POTENTIAL DURING CHEMICAL MECHANICAL POLISHING FOR END POINT DETECTION |
摘要 |
<p>A technique for utilizing a sensor to monitor fluid pressure from a fluid bearing located under a polishing pad to detect a polishing end point. A sensor is located at the leading edge of a fluid bearing of a linear polisher, which is utilized to perform chemical-mechanical polishing on a semiconductor wafer. The sensor monitors the fluid pressure to detect a change in the fluid pressure during polishing, which change corresponds to a change in the shear force when the polishing transitions from one material layer to the next. In order to ensure that there is a noticeable difference in the shear force variation at the polishing end point, a slurry having a particular pH level is selected. The pH level ensures that the zeta potential changes noticeably from one material to the next, so as to induce a change in the shear force, which is detected by a change in the fluid pressure.</p> |
申请公布号 |
WO0025983(A1) |
申请公布日期 |
2000.05.11 |
申请号 |
WO1999US23662 |
申请日期 |
1999.10.13 |
申请人 |
LAM RESEARCH CORPORATION |
发明人 |
KRUSELL, WILBUR, C.;NAGENGAST, ANDREW, J.;PANT, ANIL, K. |
分类号 |
B24B21/08;B24B37/013;B24B49/16;G01N1/32;H01L21/304;H01L21/306;H01L21/321;H01L21/768;(IPC1-7):B24B37/04 |
主分类号 |
B24B21/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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