发明名称 JOINING METHOD OF TARGET PLATE FOR SPUTTERING
摘要 PROBLEM TO BE SOLVED: To obtain an inexpensive joining method by welding an alloy coating of an element which is selected from In, Sn, Pb and an activated metal on a joining surface of a target plate which is selected from carbon, silicon and ceramic, coating a low melting point brazing filler metal onto the joining surface of a lined metallic plate and superposing the target plate on the coating of the lined metallic plate to thermally fuse them. SOLUTION: In this joining method, a process wherein superposed coating is pressurized and solid-phase welded at a temperature equal to or lower than a melting point of coating is preferably prepared, and also an activated metal is preferably Ti. The activated metal is selected from a Ti group element such as Ti, Zr, Hf, a V group element such as V, Nb, Ta, a rare earth element such as La, Ce or the like. Copper, aluminum, an alloy thereof or the like having excellent heat conductivity are used in a lined metallic plate, and a low melting pint brazing filler metal of In, Sn, Pb, Zn base is preliminarily plated on a joining surface between a target plate and the lined metallic plate. When the target plate is joined to the lined metallic plate, both coatings are fused by heating them at a temperature equal to or more than a melting point of at least one side of coated metals.
申请公布号 JP2000117427(A) 申请公布日期 2000.04.25
申请号 JP19980301762 申请日期 1998.10.09
申请人 DAI ICHI HIGH FREQUENCY CO LTD 发明人 MIYATA SEIICHIRO;KOBAYASHI RYOJI
分类号 B23K1/19;B23K1/20;B23K101/34;B23K103/18;C23C14/34;(IPC1-7):B23K1/19 主分类号 B23K1/19
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