发明名称 METHOD FOR MANUFACTURE OF ELECTRONIC PARTS
摘要 <p>A composition used as a resist in the manufacture of electronic parts, for example printed circuits, and which is rendered soluble in a developer by patternwise delivery of heat, comprises a polymer and optionally an infrared absorbing compound. However in contrast to conventional compositions no compound is present which alters the solubility of the polymer in an aqueous developer.</p>
申请公布号 WO2000020223(A1) 申请公布日期 2000.04.13
申请号 GB1999003314 申请日期 1999.10.06
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