BUMP-FORMING BARRIER METAL AND FORMATION OF THE BUMP

摘要

PROBLEM TO BE SOLVED: To provide a bump-forming barrier metal, which can form a bump having small thickness dispersion without increasing cost and without imparting breakage to a wafer. SOLUTION: This is a bump-forming barrier metal, which is present between an electrode 2 and a bump 4, when a stud bump 4 is formed on the electrode 2 formed on a semiconductor element 1. The metal is formed by bonding a sheet-shaped member 3, comprising the material that does not diffuse into the metal constituting the stud bump 4 on the electrode 2 through ultrasonic-wave welding.