APPARATUS AND METHOD FOR ADHERING INGOT AND SUPPORT MEMBER AND METHOD FOR CUTTING INGOT AND SYSTEM FOR AUTOMATIC MANUFACTURING OF WAFER

摘要

An apparatus for adhering support members to a cylindrical ingot (13) is provided. The ingot (13) has a crystal orientation (L2). A support plate (21) is mounted on a machine (326) for slicing the ingot (13). The apparatus has a measuring device (28) for measuring the crystal orientation (L2) of the ingot (13) based on a diffraction of X-rays. Based on the measured crystal orientation (L2), a rotating device (38, 40) rotates the ingot (13) about a center axis (L1) thereof which is kept parallel to a prescribed first plane (18) so that the crystal orientation (L2) is placed in a plane parallel to the first plane (18). Based on the measured crystal orientation (L2), an adjusting device (91) adjusts a position of one of the support plate (21) and the ingot (13) in the plane parallel to the first plane (18) so that a mounting axis (23) extending along a longitudinal direction of the support plate (21) is aligned to the crystal orientation (L2). An adhering device (103) adheres the ingot (13) to the support plate (21). <IMAGE>