| 摘要 |
PROBLEM TO BE SOLVED: To permit sufficient adaptation to delicate differences such as the size, manner of sinking, strength of adhesive bonding and solder hardness of electronic components such as a bump electrode, a magnetic capacitor and a transistor. SOLUTION: A gripping device 1 houses a probe 4 provided with a gripping part 17 to grip a bump electrode (electronic component) in an inner tube 2. The lower end of the probe 4 is provided in such a way as to be freely retractable in the lower end of the inner tube 2, and its upper end is engaged with an outer tube 3 spirally engaged with the inner tube 2 and is protruded from the upper end of the outer tube 3. On the other hand, the lower end of the probe 4 is formed so that its setting distance from the lower end of the inner tube 2 can be adjusted by adjusting the state of spiral engagement to the inner tube 2.
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