发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device which can form a stable capacitor by forming an etching prevention film for preventing the upper region of a storage contact plug and a storage node from being overetched by an etching by-product, which is generated when an insulation film is etched by forming an insulation film which is formed in a conductive film lower part for formation of a storage node of a film which is different from the conventional. SOLUTION: A storage node 116 is formed by overetching a second conductive film 110 on an uppermost part layer on a multilayer insulation film 108 comprising nitrogen components. Since an etching preventing film 118 is formed in both side walls of a second conductive film, it is possible to prevent the increase of resistance and falling down of the storage node 116 generated as a storage contact plug 114 inside a contact hole, and the storage node 116 are etched due to overetching for the formation of the storage node 116.
申请公布号 JP2000068480(A) 申请公布日期 2000.03.03
申请号 JP19990189007 申请日期 1999.07.02
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 RI SEKYO;KEN GOEKI
分类号 H01L23/522;H01L21/02;H01L21/28;H01L21/3213;H01L21/70;H01L21/768;H01L21/8242;H01L27/108 主分类号 H01L23/522
代理机构 代理人
主权项
地址