Method of laminating a flexible circuit to a substrate.

摘要

The method enables a flexible plastic film 14 having electronic circuit traces 16 to be attached to a rigid plastic substrate. The film and substrate are made from different, incompatible plastic materials that do not bond to one another and have different expansion coefficients. The film 14 has a backing surface 18 to which heat activated adhesive 20 is applied. The film 14 is placed within an open injection mould 10 and the mould is closed. A hot plastic resin is injected into the mould 10 via inlet 12. The resin heats the adhesive above its activation temperature and causes the adhesive to bond to both the backing surface 18 and the plastic resin. The resin is allowed to cool and the finished circuit assembly is removed from the mould.