| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board of a constitution, wherein even if the diameters of Ag via hole conductors are made large, the reliable connection between wiring conductors is secured and cracks on the board and the projections of the via hole conductors from the surface of the board are small. SOLUTION: This board 10 is constituted into a structure, wherein Ag internal wirings 3 are arranged between a plurality of dielectric layers 1a to 1e consisting of a glass component and a ceramic component, and via hole conductors 4 to penetrate the layers 1a to 1e are respectively arranged in the layers 1a to 1e. In this case, with the conductors 4 formed their diameters into a diameter of 80μm or longer, the conductors 4 are formed so as to contain an Ag conductor, 2 to 5 wt.% of aβquartz in a solid component and 0.1 to 1 wt.% of at least one kind of the oxide of a magnesium oxide, an aluminium oxide and a calcium oxide in a solid component. |
