| 摘要 |
PROBLEM TO BE SOLVED: To avoid defects in corner parts of a semiconductor element chip diebonded onto a package. SOLUTION: In this semiconductor device, recesses 37 for bringing an facing opposite pair of a semiconductor chip 32 into no contact with a package side are provided on a dieattach part 36 of a package 31, so that the semiconductor chip 32 with four corners brought into no contact with the package 31 can be diebonded onto the dieattach part 36 through the intermediary of an adhesive.
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