| 摘要 |
PROBLEM TO BE SOLVED: To prevent the occurrence of a bridge when electrodes are soldered to the pattern of a circuit board by respectively forming the electrodes on four sides of a square substrate, a filmy resistor between adjacent two electrodes, and another filmy resistor between the other two adjacent electrodes. SOLUTION: A tandem resistor chip A1 is formed in such a way that about 1/4 circular arcuate notches 2 are formed at four corner sections of a square substrate 1 and a pair of electrodes 3 are formed separately from the notches 2 on each side of the substrate 1. Each electrode 3 is formed in such a way that the electrode 3 can be soldered to the pattern of a circuit board by applying electrode forming paste to the front surface, rear surface, and end face of the substrate 1 in each electrode forming area and baking the paste. Then a filmy resistor 4 having a trapezoidal shape is formed between the electrode 3 which are formed side by side on both sides of one corner section and nearly the same filmy resistor 4 is formed between the remaining electrodes. Therefore, the occurrence of a bridge can be prevented when the electrodes 3 are soldered to the pattern of the circuit board.
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