| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for mounting electronic parts wherein, even with an electronic part with laminated elements comprising a baked ceramics plate, no electrical connection between elements is disconnected nor the ceramics plate is cracked, even when a gap is caused between laminated ceramics plates. SOLUTION: An electronic part 10 comprises a laminate 12 wherein elements 14 with an electrode formed on a baked ceramics plate are laminated. External electrodes 20a and 20b are formed at both end parts of the laminate 12. The electronic part 10 is mounted on a substrate 30 while the external electrodes 20a and 20b of the electronic part 10 are connected to a land 32 formed at the substrate 30 using a solder 34. Here, the electronic part 10 is so mounted on the substrate 30 that a laminating surface of the laminate 12 is orthogonal to the surface of the substrate 30.
|
