| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a semiconductor mounting circuit board at a low cost, where the circuit board can be enhanced in wiring density by micronization of wirings. SOLUTION: An insulating resin layer 12 is formed of photosensitive resin or thermosetting resin on a metal board, and viaholes 13 are provided to the resin layer 12 by photoetching or laser processing. Thereafter, conductor 14 is filled into the viaholes 13 through electroless plating or the like, and a wiring pattern 15 is formed on the insulating resin layer 12. Then, an insulating protective film 16 is formed on all the upside of the insulating resin layer 12, and an opening 17 is provided to the protective film 16 at a position corresponding to a flip chip connecting part 18a. Thereafter, the metal board under the insulating resin layer 12 is etched, whereby outer terminals 19, a board reinforcing bodies 20, and mount reinforcing bodies 21 are formed on the underside of the insulating resin layer 12, and buffer metal layers 25 to 27 and a pad 18 are formed on the metal-exposed part of a circuit board 11. |
