| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of bonding an electronic circuit, which does not cause the positional deviation of members to be bonded when the members to be bonded are carried. SOLUTION: An oxidation of the surfaces of members to be bonded, such as an LSI and a wiring board, a solder 14 and pads and contaminated films on the surfaces of the members to be bonded, the solder 14 and the pads are removed by a sputter cleaning unit 100, the members to be bonded are aligned with each other in the atmosphere by projection parts, which are respectively provided on both of the members to be bonded and respectively have a protruding part and a recessed part, in an alignment unit 300, and the members to be bonded and the solder 14 are heated and melted in a belt furnace 200 in a nonoxidizable or reducing gas atmosphere. In such a way, the alignment of the members to be bonded is facilitated and a method of bonding an electronic circuit has the effect of preventing the positional deviation of the members to be bonded due to vibrations during a carrying of the members to be bonded subsequent to the alignment or the like. |
