SURFACE-MOUNTING METHOD FOR ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a surface-mounting method of electronic components which can improve quality and productivity and reduce cost. SOLUTION: The surface-mounting method of electronic components includes a printing process in which solder paste 25a and 25b is applied to the electrode parts 21c and 21d of a wiring board 21 to which the terminals 22a and 23a of a plurality of small-size electronic components 22 and 23 are connected by printing, a bonder coating process in which predetermined positions on the wiring board 21 on which a plurality of large-size and small-size electronic components 14 and 23 are mounted are coated with bonder 17 and a mounting process in which the large-size and small-size electronic components 14, 22 and 23 are mounted on the bonder 17 and the solder paste 25a and 25b by using a mounter.