发明名称 |
IMPROVED LEADFRAME STRUCTURE WITH LOCKED INNER LEADS AND PROCESS FOR MANUFACTURING SAME |
摘要 |
An improved leadframe structure and process of manufacturing the same are provided. The leadframe includes a plurality of leads with inner portions extending toward an IC bonding pad within an IC encapsulation area. A polymer structure having a preselected configuration is provided to interlock the inner portions of the leads to prevent lateral, torsional and vertical displacement thereof during the IC packaging process, thus improving yield and reducing packaging cost. |
申请公布号 |
EP0963605(A2) |
申请公布日期 |
1999.12.15 |
申请号 |
EP19970953573 |
申请日期 |
1997.12.19 |
申请人 |
GCB TECHNOLOGIES, LLC |
发明人 |
BUCCI, GUISEPPE, D.;VOISIN, PAUL, H. |
分类号 |
H01L23/50;H01L23/495;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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