Vorrichtung zum Polieren eines Halbleiters

摘要

A semi-conductor wafer polishing machine (10) having a polishing pad assembly (14) and a wafer holder (12) includes a support (24) positioned adjacent the polishing pad assembly (14). The support (24) includes multiple fluid bearings (34) that support the polishing pad assembly (14) on the support (24). These fluid bearings (34) are arranged concentrically to provide concentric regions of support for the polishing pad assembly (14), and each fluid bearing (34) is coupled to a respective source of pressurized fluid at a respective pressure.