| 摘要 |
PROBLEM TO BE SOLVED: To make the alloy wire adequately cope with the loop trailing in wire bonding and the deformation of the loop hard to occur, even as the bonding wire for multiple-pin device by providing a sufficient heat resistance and the sufficient tensile strength at the normal-temperature and high temperature state for forming the further smaller ball and the thin diameter of a gold wire. SOLUTION: In high-purity gold, calcium of 5-50 weight ppm, yttrium of 5-50 weight ppm, samarium of 3-70 weight ppm, beryllium of 2-10 weight ppm and germanium of 5-50 weight ppm are added, respectively. The total quantity of these added elements is set in the range of 20-200 weight ppm, and the remaining part comprises unavoidable impurities. In this way, even in the gold alloy fine wire of the thin diameter (25 μm ϕ at the morphology level of actual program), both normal-temperature and high-temperature tensile strengths are superior, heat resistance and the tensile strength at the normal temperature are superior, and loop drooping and the deformation of the loop do not occur. |
