DEVICE AND METHOD FOR HANDLING SUBSTRATES

摘要

The inventive device for handling substrates (21, 25) which have an inner ho le has an inner gripper (2) and an outer gripper (3). Said inner gripper takes the form of an inner hole gripper (2). According to the inventive method for handling substrates (21, 25) with an inner hole, a first substrate (21) is grasped by the inner hole gripper (2), brought into contact with an outer gripper (3) and grasped by the outer gripper (3). The inner hole gripper (2) is released and moved through the hole in the first substrate before graspin g a second substrate (25).