| 摘要 |
PCT No. PCT/JP97/04342 Sec. 371 Date Jul. 31, 1998 Sec. 102(e) Date Jul. 31, 1998 PCT Filed Nov. 27, 1997 PCT Pub. No. WO98/24861 PCT Pub. Date Jun. 11, 1998The present invention provides a hot melt adhesive composition comprising an epoxy-modified block copolymer obtained by epoxidizing a carbon-carbon double bond of a conjugate diene component in a block copolymer having a polymer block (A) comprising mainly a vinyl aromatic compound and a polymer block (B) comprising mainly a conjugate diene compound in one molecule, a paraffin wax having a melting point of 40 to 100 DEG C., a tackifier and an antioxidant. The hot melt adhesive composition of the present invention is well compatible with a paraffin wax and a tackifier because it has an epoxy group which is a polar group in a molecule. Further, the hot melt adhesive composition has excellent heat resistance and cold resistance because of a combination of the epoxy-modified bloc copolymer as a base polymer with paraffin wax, and while the melt viscosity is low, the heat resistance is high.
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