| 摘要 |
PROBLEM TO BE SOLVED: To select chip-type electronic components from ball-like plating sub- material which is used at the barrel plating with high selecting accuracy and high selecting performance. SOLUTION: In addition to tilting a belt conveyer 1 for arranging one of both rollers 2 and 3 at its both ends to be higher and the other to be lower at a view from its side face, the conveyer 1 is tilted so as to arranged one-side tip parts of both the right/left tip parts of both the rollers 2 and 3 to be higher and the other-side tip parts to be lower, as a viewed from its front face. Then, the mixture of chip-type electronic components and ball-like plating sub-material is drop-supplied to the top surface of this conveyer 1 from a supplying means 6 by a fixed quantity each time. |
