| 摘要 |
PROBLEM TO BE SOLVED: To obtain adhesive properties of an excellent resin to a copper foil at the time of processing a microcircuit or multilayering by using the copper foil pretreated by a three-dimensionally crosslinked silicone oligomer. SOLUTION: A copper foil pretreated by three-dimensional crosslinked silicone oligomer is used. The foil having 5 to 200μm to be normally used for a laminate is used. A composite foil of a three-layer structure in which a copper layer of 0.5 to 15μm and a copper layer of 10 to 300μm are provided on both sides of an intermediate layer as a nickel, nickel-phosphorus, nickel-tin alloy, nickel-iron alloy, lead, lead-tin alloy or the like as an intermediate layer or a composite foil in which an aluminum and a copper foil are composited can be used. An adhering amount of the silicon oligomer to the copper foil is preferably 0.01 to 10.00 wt.%. as a resin for the copper-clad laminate, for example, an epoxy resin, polyimide resin, triazine resin, phenol resin, melamine resin, modified resin or the like is used. |
