| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device using an inexpensive lead frame which can cope with the thinning and downsizing of the semiconductor device. SOLUTION: This is a thin semiconductor device using a lead frame not having a die pad as a semiconductor chip mount. In this case, the inner lead tip 2 whose chip mounting face side is thinned by etching or press processing is made a semiconductor chip 3 mount, and a semiconductor chip 3 is mounted on this mount through an insulating adhesive or a tape fitted with an insulating adhesive, and the electrode pad at the surface of the semiconductor chip 3 and the inner lead part 2 not thinned are bonded with each other by wire 7, and these are sealed with resin to get a complete semiconductor device.</p> |
