| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC module and an IC card which can suppress the short-circuit and the corrosion of a wiring part even if moisture enters the gap between the IC module and a card base material or water gathers there and improves the water resistance. SOLUTION: This IC module 3 is provided with a module base material 30, an external terminal 31 provided on one surface of the module base material 30, an IC chip 34 provided on the other surface of the module base material 30, a wiring part 33 which is formed on the other surface and is connected to the IC chip 34, a through hole 32 which penetrates the module base material 30 and electrically connects an external terminal 31 and the wiring part 33, a sealing resin 36 which seals the IC chip 34 and the wiring part 33 nearby the IC chip 34 and a protection layer 37 which is formed covering the wiring part 33 in a portion except the poprtion sealed with the sealing resin 36. |
